German research looks at system-in-package (EETimes)
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December 9th, 2009 |
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In order to carry out research into an end-to-end SiP design environment, Infineon Technologies AG has spearheaded the CoSiP project with its partners Amic Angewandte Micro-Messtechnik GmbH, the Fraunhofer Institute for Reliability and Microintegration (IZM), the automotive electronics division of Robert Bosch GmbH, and the corporate technology division and healthcare sector of Siemens …
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German research looks at system-in-package (EETimes)
